Blade Dicing

There are several different types of blade dicing equipment. There is High-speed micro-dicing, Simac dicing, and Metal-bonded dicing. The type of blade you need will depend on the material you want to process. There are also different types of blades, including those that cut in a circular pattern.

High-speed micro-dicing

Micro-dicing technology involves the use of blades to slice wafers in a high-speed process. The feed rate of the blades determines the throughput of the process, which in turn determines the overall dicing yield. The feed rate can be optimized using parameters such as the blade type and spindle speed. Combining these parameters can lead to maximizing throughput and minimizing blade damage.

Blades used for high-speed dicing require a constant coolant flow and other parameters to run the process. In addition, the blades must have an optimal bonding material for cutting. Blades with a softer bonding material will provide a better cut but will wear more quickly than hard-bonded blades. These factors must be balanced with the desired chip size. Fortunately, DOE can help determine the proper compromise.

High-speed micro-dicing with blade technology has several advantages. The first is increased productivity. The second advantage is the increased yield. Despite the increased yield, dicing may damage delicate microstructures. However, this can be avoided by reducing the speed and water pressure of the blades. Another benefit of this technique is the ability to release microstructures after dicing.

A high-speed dicing process requires high feed speeds. The speed increases the temperature, which causes radial wear of the blade. When the blades reach a higher temperature, the resin bond melts and causes the cutting process to accelerate. This causes higher radial wear of the blades than metal-bonded blades.

In high-speed micro-dicing with blades, high-speed blades cut materials with near-perfect edges. The blades used for this process typically last two to four times longer than dicing.

Simac dicing

Simac blade dicing technology is used for a wide range of applications, from plastic packaging to BGA and compound semiconductors. The Simac team’s extensive experience, expertise, and product range make the company a great partner in all types of dicing processes. They offer competitive prices, free samples, and short delivery times.

These blades are bonded to an aluminum hub to improve cut quality. They have a high cooling flange and require only minimal shore dressing, which helps prolong blade life. Resin bond dicing blades have a longer life and are more forgiving than metal-bond blades. They are an ideal choice for applications that require a high surface finish and/or Ultra Hard and Brittle Materials.

Simac blade dicing technology features three basic dicing processes. The first method involves cutting a product into small dice or blocks. This can be done manually or with a machine. In either case, the saw blade has cutting edges that slice the material. The blade feed movement is triggered by applying pressure to the material to be processed.

Another dicing technology is resin bond dicing, which uses high-temperature phenolic resin, diamond particles, and ceramic filler. High-quality diamonds cannot be used in resin bond blades because they are harder than the matrix. Moreover, high-quality diamonds would disintegrate the resin bond. As a result, the resulting cut will be less perfect, which can cause excessive blade dressing.

Another method is stealth dicing, which uses a diamond-grit blade that rotates at a high speed. This method is suitable for processing wafers with thin-to-medium thicknesses. It also produces reduced dielectric constants, which are needed for high-speed operations. However, it is not ideal for thin-wafer materials, so it is important to select the right blade for the job at hand.

Metal-bonded dicing blades

Metal-bonded dicing blades are used in semiconductor fabrication processes. They are available in a variety of sizes, but typically are six-inch or eight-inch in diameter. These blades can range in thickness from 100 to 650 microns. They have a high wear rate and can be used to cut hard materials quickly. However, this wear characteristic also causes the blade’s life to be shorter. Newer hybrid and extended-wear resin-bonded dicing blades use different phenolic resins.

Metal-bonded dicing blades offer several benefits, including high accuracy. Compared to resin-bonded diamond blades, metal-bonded blades can withstand high-speed processing without experiencing excessive wear. Their high rigidity, high sharpness, and low-wavy cutting characteristic make them valuable assets for the electronics industry. They are also available in a variety of bond types, allowing for precise control of diamond concentration.

Typically, metal-bonded dicing blades have a narrower blade width than resin-bonded blades. They also require less shore dressing, and they can last much longer. Their aluminum-based hubs also allow the blade to cool faster, which results in longer blade life. Despite the disadvantages of metal-bonded dicing blades, these blades are a great option for Ultra Hard and Brittle Materials. They are also highly recommended for applications that require high-quality surface finishes.

Metal-bonded dicing blades have the advantage of higher dicing force, which means they can cut a greater amount of wafer per minute. Higher feed speeds, however, require higher spindle currents and increase the dicing force. However, this will result in increased vibration, which will reduce the dicing quality.

Circular Cut

Using a circular cut when blade dicing in San Jose can significantly reduce the diameter of a wafer. It is done by rotating the chuck table while the blade enters the wafer. This will create a smaller wafer with a smoother edge. In addition, dicing and grinding can be used to improve the edge quality of a wafer and help stabilize it so it doesn’t fracture.

Blade dicing machines are typically available with different types of cutting blades. Some have multiple blades, while others have only one. Dual spindle dicing saws, for example, can have two cutting blades, which can solve a number of problems. A dual spindle dicing machine is integral to wafer singulation and can reduce process time.

The microstructure of the blade is altered when an aluminum layer is formed on it during blade dicing. This process is also known as abrasive wear. The resulting cracks may result in tool wear and a reduced blade lifetime. Moreover, this operation is not without risk of damaging the surface of the dicing blade.

The TFMG coating is a protective layer that reduces chip size. The TFMG coating has a high hardness, ductility, and low CoF, which prevents the blade from deteriorating. In addition to reducing chip size and reducing the risk of a chip, TFMG coating shields the sintered metal on the blade and makes it resistant to wear and tear.

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Back-side chipping

In blade dicing, the cutting blade crushes the substrate material and removes the debris at the same time. This process occurs along dedicated dicing lines, which lie between active areas of the dice. As the blade moves along these streets, a groove is formed in the substrate material. The width of the groove varies depending on the blade thickness.

To control back-side chipping, process engineers need to choose the right blades and use the appropriate feed rate. They should also determine the dicing process parameters, which may affect back-side chipping. While blades are not immune to chipping, the process can be optimized to reduce back-side chipping, reduce cost, and increase throughput.

When using a blade dicing saw, it is important to check the nozzle and coolant concentrations. A blade with insufficient coolant will suffer from excessive chipping. It may also be clogged or have an incorrect nozzle adjustment. Another important step is to clean the recirculating tank to avoid bacterial growth. It is also important to ensure proper lubrication, as this will prevent corrosion.

In addition to the dicing blades, other factors should be considered, including the hardness of the material, the thickness of the material, and the feed rate. These factors will determine the life of the blades. If the dicing blade is too thin, it will suffer from increased back-side chipping. To solve this issue, the best solution is to use a thin wafer dicing blade with extremely fine grit.

The feed speed must be optimized to minimize chipping. Adjusting the feed speed and wafer theta correction will help reduce the variation in the sample. A slower feed speed will reduce the chipping on the backside.

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